Hollow Bar

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资质认证工艺流程

详细介绍

[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[产品参数, 参数]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]

Device parameters

AISI 4140

chemical composition:

C	Si	Mn	P	S	Cr	Ni	Mo	To the	With	H2
0.38-0.44	0.15-0.35	0.75-1.00	<0.020	<0.030	0.80-1.10	<0.25	0.15-0.25	0.02-0.05	<0.25	<2PPM

Mechanical behavior:

Tensile strength (MPa)	Yield strength (MPa)	Elongation(%)	rate of reduction in area(%)	Impact energy Akv(J)	hardness
>=1080(110)	>=930(95)	>=12	>=45	>=63	<=229HB