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资质认证工艺流程

详细介绍

[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[产品参数, 参数]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]

Device parameters

Chemical Compososition (m%)

Grade	C	Si	Mn	Cr	Cu	P	S	Ni	Nb
16MnD	0.13-0.20	0.20-0.60	1.20-1.60	≤0.25	≤0.20	≤0.020	≤0.010	≤0.40	≤0.030

Mechanical properties:

Nominal thickness mm	≤ 100	> 100 ~ 200	> 200 ~ 300
Heat treatment state	Q+T (minimum tempering temperature 620℃)
Tensile strength R m / Mpa	480-630	470-620	450-600
Yield strength R p0.2 / Mpa	≥305	≥295	≥275
Elongation A /%	≥20
Impact test, KV 2 / J	≥47@-45℃	≥47@-40℃

*Charpy V-notch impact absorption energy value is the average value of 3 samples. The value of one sample is allowed to be lower than the specified value, but not less than 70% of the specified value.